Jiang Wei, Zhou Weining, Lin Feng, Wang Jinbao
(China National Engineering Research Center of Special Mineral Materials, 541004)
Abstract X-ray diffraction (XRD) analysis with sin2ψ method was used to determine the average thermal residual stresses in the surface of PcBN. The thermal residual stresses in the PcBN composite were obtained ranging from about 4.6612 GPa to 3.3143 GPa with different sample. It is found that the stress value decreases with the velocity decreasing of temperature. The stress emerges due to the coefficients differences of thermal expansion among the PcBN phase, the Co binder and the WC-Co substrate. In addition, the gas emerges during synthesis of the PcBN composite. It shows the alkalescency with the PH test paper, so it may be NH3.
Keywords polycrystalline cubic boron nitride compacts; residual stress; analysis