Application No.: CN201010146148.8

Application Time: Apr 14,2010

Announcement Time: Nov 10,2010

Patentee: Xiamen ZL Diamond Technology Co.,Ltd

Our company invented and announced a kind of diamond wire saw, which includes diamond grains, substrate in slice, rubber and plastic material layer and the center line in the center of rubber and plastic materials layer. The above diamond grains are fixed on the substrate slice. And the rubber and plastic materials layer coats center line, sheet substrate and the parts of diamond grains but except cut surface. The manufacturing process of diamond wire saw is easy and the cost is low. It is not easy to fall off for the diamond grains in the wire saw during the cutting process.