Nanodiamonds boost thermal conductivity
Post Date: 19 Jul 2014 Viewed: 989
Nanodiamond additives can improve thermoplastic thermal performance according to Carbodeon Ltd. Oy of Vantaa, Finland.
The company claims thermal performance can be hiked by 20 percent by using as little as 0.03 percent by weight of its functionalized nanodiamonds when thermal filler loading of boron nitride is at 45 percent.
“The performance improvements achieved are derived from the extremely high thermal conductivity of diamond,” notes Carbodeon chief technical officer Vesa Myllymäki. Carbodeon treats the nanodiamonds to increase their affinity for polymers and fillers and for agglomeration control.
Nanodiamonds are made by a detonation process. Untreated particles tended to clump, restricting the use of the nanodiamonds, which have particle sizes of 4 to 6 nanometers. Carbodeon’s treatment processes help the materials live up to their promise at low concentrations, cost-effectively. Carbodeon calls its treated nanodiamonds uDiamond.
Thermal conductivity increases of up to 100 percent are possible when uDiamond levels are raised to 1.5 percent with thermal filler content of 20 percent.
Carbodeon claims thermal performance increases don’t affect electrical insulation or other mechanical properties. Tool wear is low, the firm adds.
uDiamond is suited to electronics and light emitting diode applications. Carbodeon recently was granted a patent on composites containing the materials.