Abstract By use of matrix method,the mathematical model of grinding marks on large size wafer self-rotating grinding is developed.With the developed model,the selection principles of the factors which include the radius of the diamond wheel,the rotating speed,the rotation direction of the silicon wafer and diamond wheel,and the relationships between grinding marks and those factors are discussed.The rules of resultant motion speed of abrasive grains are also studied.The results show that the curvature of the grinding marks will get less curved as the radius of the diamond wheel increases.A smaller diamond wheel will be better for the improvement of the surface quality of the silicon wafer.When the speed ratio i is positive,the grinding marks tend to be less curved as the speed ratio i increases.In case that the speed ratio i is negative,the curvature of the grinding mark is about 0 and the grinding mark is approximately a line when the speed ratio i is-2.The resultant motion speed of the abrasive grains goes up as the rotating speed of the diamond wheel and the wafer increases.

Keywords wafer self-rotating grinding;grinding marks;resultant motion speed

CopyFrom:abrasivesunion(http://www.abrasivesunion.com/)