Abstract: synthetic diamond is competitive in heat dispersing materials, because it has high thermal conductivity, low coefficient of thermal expansion and lower price. This paper overviews the manufacturing process, compact density, thermal conductivity and the interfaces of the diamond/aluminum and diamond /copper composites. There maybe two ways of improving the thermal conductivity of diamond/metal composites, one is direct bonding between diamonds in high pressure, the other is adding active carbon elements (B, Cr, etc).

Keywords: synthetic diamond     aluminum     copper     heat     dispersing materials     thermal conductivity