Abstract: The effect of titanium additive on the properties of low temperature Al-Cu-Sn-Ni bond, such as sintering temperature, hardness, bending strength, microstructure and phase composition were studied by means of hot pressed sintering, bending strength measurement, differential thermal analysis (DTA), HRB, scanning electron microscope (SEM) and X-ray diffraction (XRD) analysis. The results showed that titanium could decrease the sintering temperature, and improve the hardness and bending strength of Al-based bond. The effect of titanium and sintering mechanism at low temperature of the bond presented above are also analyzed.

Keywords: low temperature Al-based bond Ti