ABSTRACT: With different cutting conditions, the frame sawing process is simulated by the cutting experiments with single mad single diamond segment on CNC milling and by the sawing experiment on a model machine. The surface topographies of machined surfaces are observed. The surface profiles and the cutting forces as well as the distribution of chip sizes in the frame sawing process are measured. The results showed that the intercross of the cracks generated by different diamonds on various positions will decide the final removal mechanism of stone. Only a few diamonds act as effective cutting edges. In sawing process the depth of cut of diamond or segment, shape and orientation of diamond, coolant, cutting paths and the properties of stone and so on will affect the removal of stone as plastic deformation and fracture. The cutting forces and the chip sizes. Finally a cutting mechanism model for frame sawing is provided.

KEYWORDS: Frame sawing    Diamond segment    cutting mechanism