Element Six is proud to announce the commercial availability of DIAFILM 200, the world’s first diamond thermal material that can offer users thermal conductivity in excess of 2000W/mK. This novel, top-end grade of CVD (chemical vapour deposition) diamond thermal material caters for advanced users that work with high power, or high power density devices, and require extreme performance for their thermal packaging needs. The availability of this material demonstrates Element Six’s market-leading expertise in CVD diamond synthesis and material characterisation, which extends the company’s portfolio of thermal materials to even higher heat spreading capabilities.

The new product is a DIAFILM TM 200 material, exhibiting a thermal conductivity of Tc>2000 W/mK. As the other material grades of the DIAFILM TM series, it is fully isotropic, i.e. spreads the heat equally efficient in a planar direction as well as through the material. Its unique combination of properties, such as high thermal conductivity, electrical insulation, low density and chemical inertness make it the material of choice for advanced thermal management needs, such as the advanced packaging industry.

“Diamond is the highest thermally conductive material and this new product pushes thermal conductivity of commercially available diamond to groundbreaking new levels,” commented Thomas Obeloer, Business Development Manager, Thermal Applications, at Element Six. “It is a further indication that Element Six is at the forefront of thermal conductivity, constantly innovating to break barriers and bringing new products to market. We have already had positive feedback from customers in the telecommunications and laser diode sector who were early adopters of this product and now the product is commercially available we look forward to seeing other customers benefit from its unique speed of thermal conductivity and insulation capabilities.”

Material blanks are available in standard thicknesses and to customer requirements. To match the high performance of the diamond, the use of high quality, sputter deposited thin film metallisation is offered, and specifications to meet advanced needs for wire bonding or direct deposition of solder materials onto the CVD diamond can be supplied.

Element Six DIAFILM 200 is being launched on 22nd March 2011 at Semitherm 27 in Santa Clara, California, the international forum dedicated to Semiconductor Thermal Measurement, Modelling and Management.